Memory IC 71T75602S133BGGI product image

71T75602S133BGGI

  • Description:IC SRAM 18MBIT PARALLEL 119PBGA
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray

SKU:7dd31fc6fe92 Category: Brand:

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71T75602S133BGGI is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 18MBIT PARALLEL 119PBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for 71T75602S133BGGI

  • Description:IC SRAM 18MBIT PARALLEL 119PBGA
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, SDR (ZBT)
  • Memory Size:18Mbit
  • Memory Organization:512K x 36
  • Memory Interface:Parallel
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.375V ~ 2.625V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:119-BGA
  • Supplier Device Package:119-PBGA (14x22)
  • Access Time:4.2 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for 71T75602S133BGGI

71T75602S133BGGI

Memory IC Overview

The Renesas Electronics Corporation 71T75602S133BGGI is a synchronous static random access memory (SRAM) integrated circuit featuring Zero Bus Turnaround (ZBT) technology. It provides an 18 Mbit storage capacity organized as 512 k x 36 bits. The device supports a maximum clock frequency of 133 MHz with a typical access time of 4.2 ns. It operates within a voltage range of 2.375 V to 2.625 V and functions across an industrial temperature range of -40°C to +85°C. The component is housed in a 119-pin Plastic Ball Grid Array (PBGA) package measuring 14x22 mm.

Memory IC Feature Summary

  • Zero Bus Turnaround (ZBT) architecture enables high-speed data transfer without wait states during bus turnaround cycles.
  • Single Data Rate (SDR) interface allows for efficient parallel data processing at frequencies up to 133 MHz.
  • Industrial-grade operational capability ensures reliable performance across extended temperature ranges from -40°C to +85°C.

Memory IC Applications

  • High-performance embedded systems requiring fast, low-latency memory access
  • Network infrastructure equipment such as routers and switches
  • Telecommunications base stations and signal processing units

Memory IC Procurement Notes

Verify the specific suffix BGGI against official Renesas documentation to confirm the exact package dimensions and pinout configuration. Confirm RoHS compliance status through current datasheets, as manufacturing updates may alter regulatory classifications. Check for End-of-Life notices or Product Change Notifications that might affect long-term availability or sourcing strategies.

Memory IC Selection Notes

Select this component when system design requires wide 36-bit data paths and high throughput. Ensure the PCB layout accommodates the 119-PBGA footprint and thermal requirements. Verify that the power supply rails can maintain stability within the 2.375 V to 2.625 V window under peak load conditions to prevent timing violations.

Memory IC Part Context

This part belongs to the 71T75602 series of ZBT SRAMs, designed for applications demanding high bandwidth and low latency. The series typically includes variants with different speeds and packages. The 71T75602S133BGGI specifically targets the 133 MHz speed bin in a PBGA form factor, distinguishing it from TQFP or other BGA variants in the same family.

Memory IC Replacement Considerations

Consult official Renesas cross-reference guides for verified substitutes. Potential alternatives include other members of the 71T75602 series with compatible pinouts or updated generations like the 71V series if architectural differences are acceptable.

71T75602S133BGGI71T75602S133BGGI

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