— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC SRAM 18MBIT PARALLEL 119PBGA
- Series:-
- Mfr:Renesas Electronics Corporation
- Package:Tray
- Memory Type:Volatile
- Memory Format:SRAM
- Technology:SRAM - Synchronous, SDR (ZBT)
- Memory Size:18Mbit
- Memory Organization:512K x 36
- Memory Interface:Parallel
- Clock Frequency:133 MHz
- Write Cycle Time - Word, Page:-
- Voltage - Supply:2.375V ~ 2.625V
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:119-BGA
- Supplier Device Package:119-PBGA (14x22)
- Access Time:4.2 ns
- Grade:-
- Qualification:-
Download product information
Overview
The Renesas Electronics Corporation 71T75602S133BGGI is a synchronous static random access memory (SRAM) integrated circuit featuring Zero Bus Turnaround (ZBT) technology. It provides an 18 Mbit storage capacity organized as 512 k x 36 bits. The device supports a maximum clock frequency of 133 MHz with a typical access time of 4.2 ns. It operates within a voltage range of 2.375 V to 2.625 V and functions across an industrial temperature range of -40°C to +85°C. The component is housed in a 119-pin Plastic Ball Grid Array (PBGA) package measuring 14x22 mm.
Feature Summary
- Zero Bus Turnaround (ZBT) architecture enables high-speed data transfer without wait states during bus turnaround cycles.
- Single Data Rate (SDR) interface allows for efficient parallel data processing at frequencies up to 133 MHz.
- Industrial-grade operational capability ensures reliable performance across extended temperature ranges from -40°C to +85°C.
Applications
- High-performance embedded systems requiring fast, low-latency memory access
- Network infrastructure equipment such as routers and switches
- Telecommunications base stations and signal processing units
Procurement Notes
Verify the specific suffix BGGI against official Renesas documentation to confirm the exact package dimensions and pinout configuration. Confirm RoHS compliance status through current datasheets, as manufacturing updates may alter regulatory classifications. Check for End-of-Life notices or Product Change Notifications that might affect long-term availability or sourcing strategies.
Selection Notes
Select this component when system design requires wide 36-bit data paths and high throughput. Ensure the PCB layout accommodates the 119-PBGA footprint and thermal requirements. Verify that the power supply rails can maintain stability within the 2.375 V to 2.625 V window under peak load conditions to prevent timing violations.
Part Context
This part belongs to the 71T75602 series of ZBT SRAMs, designed for applications demanding high bandwidth and low latency. The series typically includes variants with different speeds and packages. The 71T75602S133BGGI specifically targets the 133 MHz speed bin in a PBGA form factor, distinguishing it from TQFP or other BGA variants in the same family.
Replacement Considerations
Consult official Renesas cross-reference guides for verified substitutes. Potential alternatives include other members of the 71T75602 series with compatible pinouts or updated generations like the 71V series if architectural differences are acceptable.
ChipApex | Global Electronic Components Supplier









