71T75602S150PFG

Overview

The Renesas Electronics Corporation 71T75602S150PFG is a synchronous Single Data Rate Zero Bus Turnaround SRAM IC with an 18Mb storage capacity organized as 512K x 36. It operates at a clock frequency of 150 MHz with a 3.8 ns access time. The device supports parallel interface communication and functions within a supply voltage range of 2.375V to 2.625V. It is designed for surface mount installation in a 100-TQFP (14x14) package, suitable for commercial temperature ranges from 0°C to 70°C.

Feature Summary

• Supports high-speed synchronous data transfer via ZBT technology
• Provides wide 36-bit data bus width for efficient memory handling
• Operates on a standard 2.5V core voltage supply

Applications

• High-performance embedded systems requiring fast memory access
• Network infrastructure equipment
• Industrial control applications

Procurement Notes

Verify component authenticity through authorized channels due to discontinuation status. Confirm RoHS compliance requirements against specific project standards, as packaging variations may affect regulatory adherence. Validate pin compatibility and thermal characteristics during integration planning to ensure reliable operation within specified environmental limits.

Selection Notes

Select this component when a 36-bit wide synchronous SRAM interface is required for system architecture. Consider the 150 MHz operating speed and 3.8 ns latency for timing constraints. Ensure the design accommodates the 100-pin TQFP footprint and 2.5V power domain specifications for proper board layout and power delivery.

Part Context

This part belongs to the IDT 71T75602 series of synchronous SRAM devices manufactured by Renesas Electronics. The series offers various speed grades and package options to support diverse memory subsystem designs. This specific model represents a mid-range speed variant optimized for commercial temperature environments.

Replacement Considerations

Officially documented substitutes include 71T75602S133PFGI. Verify electrical parameter compatibility and physical footprint alignment before substitution.