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Product Detailed Parameters
- Description:IC SRAM 18MBIT PAR 119PBGA
- Series:-
- Mfr:Renesas Electronics Corporation
- Package:Tray
- Memory Type:Volatile
- Memory Format:SRAM
- Technology:SRAM - Synchronous, SDR (ZBT)
- Memory Size:18Mbit
- Memory Organization:1M x 18
- Memory Interface:Parallel
- Clock Frequency:150 MHz
- Write Cycle Time - Word, Page:-
- Voltage - Supply:2.375V ~ 2.625V
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:119-BGA
- Supplier Device Package:119-PBGA (14x22)
- Access Time:3.8 ns
- Grade:-
- Qualification:-
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Overview
The Renesas Electronics Corporation 71T75802S150BGG is a synchronous static random-access memory (SRAM) integrated circuit belonging to the ZBT family. It features an 18 Mbit storage capacity organized as 1M x 18 bits with a parallel interface. The device operates at a maximum clock frequency of 150 MHz and provides a typical access time of 3.8 ns. It requires a core supply voltage between 2.375 V and 2.625 V and functions within a commercial temperature range of 0°C to 70°C. The component is housed in a 119-pin PBGA package measuring 14x22 mm.
Feature Summary
- Zero Bus Turnaround (ZBT) architecture eliminates dead cycles during bus turnaround between read and write operations.
- Internally synchronized output buffer enable removes the requirement for external OE control signals.
- Single R/W control pin simplifies interface logic by combining read and write command inputs.
- Positive clock-edge triggered registers for address, data, and control signals support fully pipelined applications.
Applications
- High-performance embedded systems requiring fast data buffering
- Network infrastructure equipment utilizing parallel SRAM interfaces
- Industrial control systems operating within commercial temperature ranges
Procurement Notes
Verify component authenticity through authorized channels due to potential availability from secondary markets. Confirm RoHS compliance status as specific variants may not meet current environmental directives. Validate package integrity upon receipt, as moisture sensitivity level 3 requires proper handling. Check datasheet revisions for any pinout or electrical parameter updates prior to final design integration.
Selection Notes
Select this part when zero bus turnaround performance is critical for system throughput. Ensure the host processor supports single R/W control signaling to leverage simplified interface designs. Verify that the application environment remains within the specified 0°C to 70°C operational range. Confirm that the 119-pin BGA footprint aligns with existing PCB layout constraints and assembly capabilities.
Part Context
This component is part of the IDT 71T75802 series, which offers various speed grades and package options including TQFP and BGA configurations. The series is designed for high-speed parallel memory applications where minimal latency is required. Other variants in the family include different clock frequencies such as 133 MHz and 200 MHz, catering to diverse performance requirements across industrial and commercial sectors.
Replacement Considerations
Consult official documentation for confirmed substitute part numbers within the same product family. Cross-reference speed grades and package dimensions to ensure mechanical compatibility. Verify electrical parameter alignment, particularly supply voltage ranges and access times, before implementing any alternative components in the design.
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