71T75802S200BG8

Memory IC Overview

The Renesas Electronics Corporation 71T75802S200BG8 is a 18Mb (1M x 18) synchronous static random-access memory (SRAM) IC utilizing Zero Bus Turnaround (ZBT) technology. It operates at a clock frequency of 200 MHz with a 3.2 ns access time, supporting high-speed parallel data transfer. The device functions within a supply voltage range of 2.375V to 2.625V and is housed in a 119-pin PBGA package measuring 14x22 mm. Designed for fully pipelined applications, it features internal synchronization of address, data, and control signals.

Memory IC Feature Summary

• Zero Bus Turnaround (ZBT) architecture eliminates dead bus cycles during read-to-write or write-to-read transitions.
• Fully pipelined operation via internally synchronized output buffer enable and single R/W control pin.
• Supports four-word burst capabilities in either interleaved or linear modes for efficient data throughput.

Memory IC Applications

• High-performance embedded systems requiring fast memory access
• Network infrastructure equipment and routers
• Industrial automation controllers

Memory IC Procurement Notes

Verify component authenticity through authorized channels as the part may be discontinued. Confirm RoHS compliance status and moisture sensitivity level prior to assembly. Ensure PCB layout supports the 119-PBGA footprint and thermal requirements for the specified operating temperature range.

Memory IC Selection Notes

Select this model when system timing requires 200 MHz synchronous performance with ZBT efficiency. Compare against lower speed variants like the S133 or S150 if bandwidth constraints allow. Verify that the 119-PBGA package fits the target board space and that the 2.5V core voltage aligns with the system power design.

Memory IC Part Context

This component belongs to the IDT 71T75802 family of synchronous SRAMs. The family offers various speed grades and packages, including TQFP and BGA options. The 'S200' suffix denotes the 200 MHz speed bin, while 'BG8' indicates the specific 119-pin PBGA packaging configuration used for surface mount applications.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Check manufacturer notices for end-of-life status and recommended alternative devices from the same product family.