71V35761S183BG8

Memory IC Overview

The Renesas Electronics Corporation 71V35761S183BG8 is a synchronous single data rate static random access memory integrated circuit. It features a parallel interface with a storage capacity of 4.5 Mbit, organized as 128K x 36 bits. The device supports a maximum clock frequency of 183 MHz and provides an access time of 3.3 ns. It operates within a supply voltage range of 3.135 V to 3.465 V and is housed in a 119-pin plastic ball grid array package measuring 14x22 mm.

Memory IC Feature Summary

• Supports high-speed synchronous burst operations for efficient data transfer
• Provides wide 36-bit data bus width for system expansion
• Includes self-timed write cycles with global write control capabilities

Memory IC Applications

• High-performance computing systems requiring fast memory access
• Network infrastructure equipment utilizing parallel SRAM interfaces
• Industrial automation controllers needing reliable volatile memory storage

Memory IC Procurement Notes

Verify component authenticity through authorized channels due to end-of-life status. Confirm RoHS compliance requirements as the part may not meet current environmental standards. Validate package dimensions against design specifications before integration. Check for available alternative sources if long-term supply continuity is required for production planning.

Memory IC Selection Notes

Select this component when a 36-bit parallel interface is mandatory for system architecture compatibility. Ensure the design accommodates the specific 3.3V power supply constraints and thermal management needs of the BGA package. Consider the 183 MHz speed grade if higher throughput than standard variants is necessary for the application timeline.

Memory IC Part Context

This part belongs to the 71V35761S family of synchronous SRAM devices manufactured by Renesas Electronics. It shares architectural similarities with other members of the series but is distinguished by its specific speed grade and pin configuration. The family is designed for applications demanding high bandwidth and low latency in embedded environments.

Memory IC Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing board layouts if considering alternative vendors or updated series revisions.