71V424S10PHGI

Overview

The Renesas Electronics Corporation 71V424S10PHGI is a static random-access memory (SRAM) integrated circuit featuring a storage capacity of 4 megabits organized as 512K words by 8 bits. It operates on a parallel interface with an access time of 10 nanoseconds and a write cycle time of 10 nanoseconds. The device supports a supply voltage range of 3 volts to 3.6 volts and utilizes a 44-pin Thin Small Outline Package (TSOP II). It is designed for surface mount installation and functions within a commercial temperature range of 0°C to +70°C.

Feature Summary

• Asynchronous SRAM technology providing fast data access without external clock synchronization
• CMOS construction ensuring low power consumption during operation
• Parallel interface architecture supporting standard memory bus connections

Applications

• Embedded systems requiring non-volatile-like data retention during power cycles
• Industrial control units needing rapid buffer storage
• Telecommunications equipment utilizing high-speed data processing

Procurement Notes

Verify the specific package variant, as suffixes may indicate different pin counts or thermal ratings. Confirm RoHS compliance status through official documentation before integration. Check for end-of-life notifications or product discontinuance notices from the manufacturer to ensure long-term availability. Validate that the operating temperature range meets your system requirements.

Selection Notes

Select this component when a 512Kx8 organization is required with 10ns speed performance in a TSOP II form factor. Compare against other members of the 71V424 family for variations in access times or package types. Ensure the 3.3V logic levels match your system's voltage domain. Consider alternative packages if board space constraints differ from the TSOP II dimensions.

Part Context

This part belongs to the Renesas 71V424 series of asynchronous SRAMs. The series offers various speed grades and package options to accommodate different design needs. The 'S' designation typically indicates specific speed or package characteristics within the lineup. This component serves as a high-performance memory solution for applications demanding reliable data storage and retrieval.

Replacement Considerations

Check for direct replacements within the same series with different speed grades or packages. Verify compatibility with existing PCB footprints if substituting with similar TSOP variants. Consult manufacturer cross-reference guides for equivalent parts from other vendors.