7201LA80DB

Overview

The Renesas Electronics Corporation 7201LA80DB is an asynchronous FIFO memory device with a capacity of 4.5K bits, organized as 512 words by 9 bits. It features unidirectional data flow and supports a maximum clock frequency of 10 MHz with an access time of 80 ns. The component operates on a single 5.0 V supply voltage within a range of 4.5 V to 5.5 V. It is housed in a 28-pin CDIP package with through-hole mounting. The device has an operating temperature range of -55°C to 125°C and is currently classified as obsolete.

Feature Summary

• Asynchronous operation for independent read and write clock domains
• Unidirectional data transfer architecture
• Wide industrial temperature range capability

Applications

• Data buffering between asynchronous systems
• Clock domain crossing interfaces
• High-speed data acquisition systems

Procurement Notes

This component is officially discontinued and obsolete. Procurement is limited to surplus or secondary market sources. Verify RoHS compliance status, as older variants may not meet current environmental standards. Confirm package integrity and pin condition upon receipt due to potential long-term storage effects.

Selection Notes

Select this part only if legacy compatibility with 28-CDIP through-hole designs is required. Consider modern surface-mount alternatives for new designs. Ensure the 80 ns access time meets system timing requirements. Verify power supply stability within the specified voltage range to maintain reliable FIFO operation.

Part Context

The 7201L series represents Renesas' high-performance asynchronous FIFO family. This specific model utilizes CMOS technology for low power consumption. It belongs to the broader IDT/Renesas memory portfolio, designed for applications requiring temporary data storage without synchronous clock constraints.

Replacement Considerations

No direct public substitute part numbers are confirmed for this obsolete component. Engineers should evaluate newer asynchronous FIFOs with similar capacity and interface characteristics, ensuring package and pinout compatibility or designing adapter solutions.