7202LA20TDB

Overview

The Renesas Electronics Corporation 7202LA20TDB is an asynchronous FIFO memory device belonging to the 7200 series. It provides a storage capacity of 9K bits, organized as 1K words by 9 bits. The component supports unidirectional data transfer with a maximum data rate of 33.3MHz and features a typical access time of 20ns. It operates within a supply voltage range of 4.5V to 5.5V and draws a maximum supply current of 80mA. The device is housed in a 28-pin CDIP package and is designed for surface mount installation. It functions reliably across an operating temperature range of 0°C to 70°C.

Feature Summary

• Asynchronous operation allows independent read and write clock domains for flexible interface integration.
• Supports bidirectional depth and width expansion capabilities for scalable system design.
• Includes relay capability to facilitate cascading multiple units for increased memory depth.

Applications

• Data buffering between high-speed processors and slower peripheral devices
• Interface bridging between systems operating at different clock frequencies
• Temporary data storage in digital signal processing pipelines

Procurement Notes

Verify the specific suffix TDB to confirm the 28-pin CDIP package configuration, as other suffixes indicate different form factors like PLCC or SOIC. Confirm RoHS compliance status, as some variants in this series may not meet current environmental standards. Check for obsolescence notices, as certain versions of the 7202LA series have been marked as discontinued by the manufacturer. Ensure the selected variant matches the required operating temperature range for the target application environment.

Selection Notes

Select this component when a 9K x 9 asynchronous FIFO structure is required with a 20ns access speed. The 28-pin CDIP package is suitable for applications requiring through-hole mounting or specific legacy board layouts. Consider the 4.5V to 5.5V supply requirement to ensure compatibility with existing logic levels. Evaluate the need for relay capability if system architecture demands cascading multiple FIFO units for expanded memory depth beyond the single-chip capacity.

Part Context

This part belongs to the Renesas 7200 series of asynchronous FIFO memories, which are CMOS parallel devices. The series offers various configurations differing in speed grades, such as 12ns, 15ns, and 30ns variants, and packaging options including PLCC, LCC, and SOIC. The 7202LA20TDB specifically represents the 20ns speed grade in the dual in-line package format, providing a balance of performance and physical footprint for industrial and commercial electronic designs.

Replacement Considerations

Direct substitutes include IDT7202LA20JG (PLCC-32) and IDT7202LA20SO (SOIC-28), which share identical electrical specifications but differ in package type. Verify pin-to-pin compatibility if replacing on an existing PCB layout. Other speed grades like 7202LA12 or 7202LA30 offer faster or slower performance respectively but maintain functional equivalence.