72255LA10PF

Overview

The Renesas 72255LA10PF is a SuperSync synchronous FIFO memory device featuring an 8K x 18 bit organization, providing 144 Kbits of storage capacity. It operates with a maximum clock frequency of 100 MHz and supports an access time of 8 ns. The component utilizes a unidirectional bus architecture and is housed in a 64-pin TQFP package. Designed for high-speed data buffering applications, it ensures reliable performance within specified voltage ranges.

Feature Summary

• SuperSync synchronous architecture for precise data synchronization
• Unidirectional data flow capability
• High-speed operation up to 100 MHz

Applications

• Data buffering in communication systems
• Interface bridging between asynchronous components
• High-speed digital signal processing pipelines

Procurement Notes

Verify current availability status as the component may be obsolete or limited. Confirm RoHS compliance details through official documentation. Check for moisture sensitivity level requirements during handling. Ensure packaging specifications match design constraints. Validate pinout compatibility with existing PCB layouts before procurement.

Selection Notes

Select this part for applications requiring 18-bit wide data paths and synchronous control. Consider the 8 ns access time for timing-critical designs. Evaluate the 64-TQFP package size against board space limitations. Verify power supply requirements align with system voltage rails. Assess thermal dissipation needs for the chosen operating environment.

Part Context

This component belongs to the Renesas 72255 series of SuperSync FIFOs. It shares architectural similarities with other parts in the family but offers specific 8K x 18 configuration. The series is known for high-performance memory solutions in industrial and communication sectors.

Replacement Considerations

Check for direct substitutes like 72255LA10PFG if lead-free options are required. Verify functional equivalence for 8K x 18 synchronous FIFO operations. Ensure package compatibility with existing footprints.