72271LA10PF

Overview

The 72271LA10PF is a synchronous FIFO memory device from the Renesas 7200 series. It features a storage capacity of 288K bits, organized as 32K words by 9 bits. The component operates with a maximum clock frequency of 100 MHz and an access time of 8 ns. It utilizes a unidirectional bus architecture and requires a core voltage of 5.0 V. The device is housed in a 64-TQFP package measuring 14x14 mm.

Feature Summary

• Supports full word first/first out (FWFT) operation for efficient data handling
• Includes programmable flags to indicate status conditions such as empty or full states
• Features relay capability to maintain data integrity during power transitions

Applications

• High-speed data buffering in communication systems
• Interface bridging between asynchronous logic blocks
• Data acquisition system temporary storage

Procurement Notes

Verify component obsolescence status prior to design finalization. Confirm RoHS compliance requirements against specific project standards. Ensure supply chain availability through authorized channels due to limited market presence. Review datasheet revisions for any pinout or electrical characteristic updates before implementation.

Selection Notes

Select this part for applications requiring high-density synchronous buffering with 9-bit data width. Consider the 100 MHz speed grade for high-throughput interfaces. Evaluate the 64-TQFP package constraints for PCB layout. Compare against other 7200 series variants if different access times or voltages are needed.

Part Context

This component belongs to the Renesas 7200 SuperSync FIFO family. These devices are designed for high-performance data buffering in digital systems. The 72271 variant specifically offers 32K x 9 organization. The family supports various speeds and voltages to suit different system requirements.

Replacement Considerations

Check for direct pin-compatible substitutes within the 7200 series. Verify electrical specifications match original requirements. Consider newer generations if available. Confirm package compatibility for existing footprints.