SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
72T72115L5BBGI is listed in the FIFOs Memory range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC FIFO ASYNC/SYN 128KX72 324BGA. Review the specifications below when checking this part for your BOM.
The Renesas 72T72115L5BBGI is a TeraSync First-In, First-Out memory device featuring an organization of 128K words by 72 bits. It supports both asynchronous and synchronous operation modes with unidirectional data flow. The component operates within a supply voltage range of 2.375 V to 2.625 V and draws a maximum supply current of 130 mA. It offers access times of 14 ns for asynchronous mode and 4.5 ns for synchronous mode, supporting clock frequencies up to 50 MHz and 100 MHz respectively. The device is housed in a 324-pin PBGA package measuring 19x19 mm.
Verify RoHS compliance status as documentation indicates non-compliance. Confirm end-of-life status and availability through authorized channels. Check moisture sensitivity level requirements for storage and handling. Validate package marking changes due to recent label updates. Ensure compatibility with existing system voltage levels.
Select this component for applications requiring high-density 72-bit wide data buffering. Consider the 324-pin BGA package constraints for PCB layout. Evaluate thermal performance given the operating temperature range. Compare access times against system clock requirements. Verify interface compatibility with source and destination devices.
This part belongs to the Renesas 72T series of TeraSync FIFO memories. These devices are designed for high-performance data buffering in telecommunications and networking applications. The series supports various data widths and depths to accommodate different bus architectures. The 72T72115 variant specifically targets wide-data path requirements.
Consult official datasheets for pin-compatible alternatives within the 72T family. Verify electrical specifications match before substitution. Check for updated package markings or assembly site changes. Confirm functional equivalence regarding FWFT and relay capabilities.
Explore related parts through Logic, Integrated Circuits (ICs), all product categories, ChipApex homepage.