72V255LA10PFG8

FIFOs Memory Overview

The 72V255LA10PFG8 is a SuperSync synchronous FIFO memory device manufactured by Renesas Electronics. It features an 8K x 18 bit storage configuration, providing a total density of 144 Kb. The component operates with a core voltage range of 3 V to 3.6 V and supports data rates up to 100 MHz. It utilizes a 64-LQFP package with a 10 ns access time. Key functional attributes include programmable flags support, depth and width expansion capabilities, and unidirectional bus direction.

FIFOs Memory Feature Summary

• SuperSync synchronous architecture for high-speed data buffering
• Programmable status flags for precise buffer management
• Supports depth and width expansion for flexible system integration

FIFOs Memory Applications

• High-speed data acquisition systems requiring temporary storage
• Digital signal processing interfaces
• Telecommunications equipment data buffering

FIFOs Memory Procurement Notes

This component is scheduled for obsolescence and will be discontinued by the manufacturer. Verify current availability through authorized distributors as stock may be limited. Ensure compliance with RoHS3 specifications and check moisture sensitivity level (MSL 3) requirements during handling and storage to prevent damage prior to assembly.

FIFOs Memory Selection Notes

Select this part for applications requiring 18-bit wide synchronous FIFO buffers with 100 MHz performance. It is suitable for designs needing programmable flags and expansion options. Consider the 64-LQFP package constraints and 3V-3.6V supply requirements when designing the power and PCB layout.

FIFOs Memory Part Context

Part of the Renesas 72V SuperSync family, designed for high-performance memory interfacing. The 72V series offers various densities and widths to meet diverse bandwidth needs. This specific model provides a balance of speed and data width for complex digital logic applications.

FIFOs Memory Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation due to the end-of-life status. Evaluate alternative components from the same family or newer generations that match the 8K x 18 specification and 64-LQFP footprint.