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72V261LA10PFG is listed in the FIFOs Memory range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC FIFO SYNC 16KX9 6.5NS 64TQFP. Review the specifications below when checking this part for your BOM.
The Renesas Electronics Corporation 72V261LA10PFG is a synchronous FIFO memory device belonging to the 72V series. It features a storage capacity of 144K bits, organized as 16K words by 9 bits. The component supports unidirectional data transfer with a maximum data rate of 50MHz and an access time of 12ns. It operates on a single 3V to 3.6V power supply and draws a maximum current of 55mA. The device is housed in a 64-TQFP surface-mount package measuring 14x14mm and functions within an industrial temperature range of 0°C to 70°C.
Verify the specific suffix configuration against official documentation, as packaging variations exist within this product line. Confirm RoHS compliance status, as different suffixes may indicate distinct environmental certifications. Check for End-of-Life notifications or Product Change Notices regarding assembly sites or labeling updates before finalizing procurement plans.
Select this component when a unidirectional synchronous FIFO with 9-bit word width is required. Ensure the design utilizes a 3.3V logic level compatible with LVTTL I/O standards. Verify that the 12ns access time meets the system timing constraints and that the 64-pin TQFP footprint fits the PCB layout. Consider thermal management within the specified operating temperature range.
This part belongs to the IDT/Renesas SuperSync FIFO family, designed for high-performance data buffering. It serves as a 3.3V version of the legacy 5V 722x5 family, offering functional compatibility while reducing power consumption. The 72V261 variant specifically targets applications requiring 16K x 9 organization, distinguishing it from wider bus variants like the 72V265.
The 72V261LA10PFG8 is a verified alternative offering identical electrical specifications but supplied in tape-and-reel packaging instead of trays. Both parts share the same core functionality, pinout, and performance metrics, allowing for direct substitution based on manufacturing packaging preferences.
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