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72V3680L7-5PF8 is listed in the FIFOs Memory range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC FIFO SYNC 16KX36 5NS 128TQFP. Review the specifications below when checking this part for your BOM.
The Renesas Electronics 72V3680L7-5PF8 is a high-performance synchronous FIFO memory device belonging to the 72V series. It features a storage capacity of 576K bits, organized as 16K words by 36 bits. The component supports unidirectional data transfer with a maximum clock frequency of 66.7MHz and an access time of 10ns. It operates within a supply voltage range of 3.15V to 3.45V and is housed in a 128-pin TQFP package measuring 14x20mm. Designed for industrial applications, it functions reliably between 0°C and 70°C.
Verify component authenticity through authorized channels due to end-of-life status. Confirm moisture sensitivity level handling procedures during assembly. Check for specific RoHS compliance variations across manufacturing lots. Validate pinout compatibility with existing PCB footprints before integration. Ensure proper static discharge precautions are maintained during handling.
Evaluate system timing requirements against the 10ns access specification. Consider the 128-pin TQFP footprint constraints for board layout. Assess power consumption limits relative to the 40mA maximum supply current. Verify interface compatibility with source and destination logic levels. Review thermal management needs for the specified operating temperature range.
This component is part of the 72V3680 family of synchronous FIFOs designed for high-speed data buffering applications. The 72V series offers various speed grades and package options to suit different system requirements. This specific variant provides a balance of speed and density suitable for complex digital signal processing tasks.
Check for direct pin-to-pin replacements within the same product family. Evaluate alternative suppliers offering similar specifications if available. Verify functional equivalence regarding control signals and timing parameters. Consider redesign implications when switching to components with different package types.
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