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The 73S1209F is a System-on-Chip device designed for smart card reader applications, functioning as a UART to ISO-7816 / EMV bridge. It integrates an 80515 high-performance core with up to 24MHz clock speed and 24MIPS processing power. The IC includes 32KB Flash program memory, 2KB user XRAM, and 256B IRAM. It supports dual power supplies: 2.7V to 3.6V digital (VDD) and 4.75V to 5.5V analog (VPC). Communication interfaces include a full-duplex UART (1200bps to 115kbps), I2C Master (400kbps), and a built-in ISO-7816 interface compliant with EMV 4.1.
Verify the specific package variant required, as the datasheet lists both 68-pin and 44-pin QFN options. Confirm that the embedded firmware meets your application's security requirements before development. Ensure the host system provides the necessary serial connectivity and power rails (3.3V and 5V typical) for proper operation.
Select this component when a complete smart card reader solution with integrated encryption processing is needed. It is suitable for designs requiring multi-card slot expansion via external Teridian 73S8010x ICs. Consider the available software libraries for EMV and ISO-7816 if custom firmware development is planned over using the turnkey option.
Manufactured by Teridian Semiconductor Corporation, now part of Analog Devices Inc./Maxim Integrated. The 73S1209F simplifies system integration by combining the microprocessor, smart card interface, and human-machine interface into a single CMOS chip. It targets cost-sensitive applications where reducing the Bill of Materials is critical.
No public confirmed substitute part numbers are documented in the provided source material.