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745-042-560-201 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 42POS 0.100. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 745-042-560-201 is a dual-edge card edge connector featuring 42 positions with a 0.100-inch (2.54mm) contact spacing. It utilizes female contacts and press-fit termination for panel installation. The insulator is black, constructed from Diallyl Phthalate (DAP). This component supports double-row configurations and is designed for high-reliability interconnection applications requiring robust mechanical retention without soldering.
Verify the specific series designation and termination type against official EDAC documentation to ensure compatibility with existing panel mounting structures. Confirm that the press-fit variant matches the target PCB hole specifications. Cross-reference the manufacturer part number with authorized distributor catalogs to validate current production status and avoid obsolete stock substitutions.
Select this model when a dual-sided card edge interface is required with non-soldered termination. Ensure the application environment accommodates the thermal characteristics of the DAP insulator. Verify that the 42-position count aligns with signal routing needs. Consider the mechanical constraints of the press-fit process during PCB design phase to guarantee proper retention force and alignment.
This component belongs to the EDAC 745 Series Ultra-Mate line of card edge connectors. It represents a specialized variant within the broader EDAC portfolio, distinguished by its dual-edge geometry and press-fit termination technology. The series is engineered for applications demanding high cycle reliability and secure mechanical locking in dense electronic assemblies.
No public confirmed substitute part numbers are available in the provided documentation. Direct replacement requires identical electrical parameters, mechanical dimensions, and termination method verification through official EDAC engineering channels.
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