748351024

Overview

The Würth Elektronik 748351024 is a WE-BPF series multilayer chip band-pass filter designed for EMI/RFI suppression. It operates within a frequency range of 2400 to 2500 MHz, centered at 2.45 GHz. The component features a 100 MHz bandwidth and an insertion loss of 1.8 dB. Packaged in a compact 1008 (2520 metric) surface-mount footprint with four pins, it provides effective signal conditioning for radio frequency applications.

Feature Summary

• Multilayer chip construction for reliable RF filtering
• Band-pass characteristic optimized for 2.4 GHz ISM band
• Compact 1008 surface-mount package design

Applications

• EMI/RFI suppression circuits
• Power line filtering systems
• Radio frequency signal conditioning

Procurement Notes

Verify the specific datasheet version and impedance specifications against current project requirements. Confirm that the 1008 package dimensions align with the target PCB layout constraints. Ensure compatibility with standard reflow soldering profiles for multilayer ceramic components to maintain electrical integrity during assembly.

Selection Notes

Select this component when a narrow band-pass response around 2.45 GHz is required for noise reduction. The 1.8 dB insertion loss indicates moderate signal attenuation within the passband. Consider the 1008 size for space-constrained designs where discrete LC filters are impractical. Evaluate thermal management needs as the device lacks active cooling mechanisms.

Part Context

This part belongs to the WE-BPF family of passive RF components manufactured by Würth Elektronik. These filters utilize advanced multilayer ceramic technology to achieve precise frequency selectivity. The series is engineered for high-volume production environments requiring consistent performance in consumer electronics and wireless communication modules.

Replacement Considerations

Cross-reference with other 2.45 GHz band-pass filters in the 1008 package. Verify matching center frequency, bandwidth, and insertion loss parameters before substitution. Ensure pinout compatibility and physical footprint alignment to avoid PCB redesign efforts.