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74ABT162244DL,118 is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC BUFF NON-INVERT 5.5V 48SSOP. Review the specifications below when checking this part for your BOM.
The 74ABT162244 is a 16-bit buffer and line driver featuring integrated 30 Ω series termination resistors and 3-state outputs. It operates within a supply voltage range of 4.5 V to 5.5 V using BiCMOS technology. The device supports four independent output enables, allowing configuration as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. It includes IOFF circuitry for partial power-down applications to prevent backflow current. The component provides latch-up protection exceeding 500 mA per JESD78B Class II Level A standards.
Verify the specific package variant against the datasheet revision history. The DL (SSOP-48) package was removed from the product specification in version 7 (July 2021). Confirm that the DGG (TSSOP-48) package is the currently supported manufacturing option for this part number to ensure compatibility with design files and availability.
Select this component when designing 5V logic circuits requiring integrated series termination to reduce reflections. Ensure the application utilizes the 4.5 V to 5.5 V operating range. Verify that the required package matches the current production status, as older SSOP variants are discontinued. Consider the multiple enable pins if independent control of data segments is necessary.
This device belongs to the ABT logic family, utilizing BiCMOS technology for high-speed performance. It functions as a non-inverting buffer/line driver. The manufacturer transitioned the primary package from SSOP-48 to TSSOP-48 in recent revisions. It serves as a direct interface solution for TTL levels while maintaining strict 3-state output control.
The 74ABT162244DGG is the active replacement for the discontinued 74ABT162244DL. Both share identical electrical specifications and functionality; they differ only in the physical package type (TSSOP vs. SSOP). Designers must update footprint layouts when switching from the DL to the DGG variant.
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