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74ABT2541CMSA is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Fairchild Semiconductor. Its product description is IC BUFFER NON-INVERT 5.5V 20SSOP. Review the specifications below when checking this part for your BOM.
The Fairchild Semiconductor MM74ABT2541CMSA is an octal buffer and line driver belonging to the 74ABT logic series. It features non-inverting logic with three-state outputs, designed for high-speed digital applications. The device operates within a supply voltage range of 2.3V to 3.6V. It utilizes a 20-SSOP surface-mount package, providing eight independent input-output channels. The component integrates 25-ohm series resistors in each output path to manage signal integrity.
Verify the specific suffix 'CMSA' against the manufacturer's official datasheet to confirm the 20-SSOP package and 25-ohm resistor integration. Ensure the operating temperature range and voltage specifications align with your system requirements before procurement. Cross-reference the part number with ON Semiconductor documentation, as Fairchild Semiconductor products are now managed under this entity.
Select this component when designing circuits requiring octal buffering with integrated output termination. The 25-ohm resistors reduce reflections in high-speed traces. Compare performance metrics such as propagation delay and drive current against standard HC or HCT families if lower speed is acceptable. Ensure the 3.3V supply rail compatibility matches the target application voltage levels.
This component is part of the 74ABT family, which offers faster switching speeds than standard CMOS technologies while maintaining compatibility with TTL inputs. The 74ABT2541 variant specifically adds series resistors to improve signal quality in high-frequency environments. It serves as a bridge between microprocessors and peripheral devices requiring buffered signals.
The MM74ABT2541CMTC is a documented substitute offering identical functionality in a TSSOP package. Verify pinout compatibility and thermal characteristics when substituting between SSOP and TSSOP form factors.
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