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74ABT541CMSA is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists onsemi. Its product description is IC BUFF NON-INVERT 5.5V 20SSOP. Review the specifications below when checking this part for your BOM.
The onsemi 74ABT541CMSA is an octal buffer and line driver featuring non-inverting logic with 3-STATE outputs. It operates within a supply voltage range of +4.5V to +5.5V and supports ambient temperatures from -40°C to +85°C. The device provides high drive capability with output sink currents up to 64mA and source currents up to 32mA. Propagation delays are guaranteed at 3.6ns maximum under standard conditions, while pin-to-pin skew is limited to 3.5ns. It utilizes a 20-Lead Shrink Small Outline Package (SSOP) for compact integration.
Verify that the specific ordering suffix 'CMSA' corresponds to the 20-Lead Shrink Small Outline Package (SSOP). Confirm compatibility with the original Fairchild Semiconductor datasheet specifications, as onsemi acquired these product lines. Ensure the component meets the required operating temperature range and voltage ratings for your specific application environment before finalizing procurement.
Select this component when high-speed data transmission requires precise timing alignment across multiple channels. The guaranteed output skew ensures synchronized signal delivery essential for parallel buses. Its robust latchup protection and high-current drive make it suitable for driving heavy capacitive loads or long traces without signal degradation.
This part belongs to the ABT logic family, which combines the speed of Advanced Schottky TTL with CMOS low-power characteristics. The 74ABT541 serves as an octal version of the buffer series, providing eight independent non-inverting paths. It shares functional similarities with other octal buffers but offers distinct drive strengths and switching speeds optimized for high-performance digital systems.
The 74ABT541CSC is a compatible alternative available in a 20-Lead SOIC package. Designers must verify pinout compatibility and ensure the replacement package fits the existing PCB footprint constraints.
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