74ABT573APW,112

Overview

The NXP USA Inc. 74ABT573APW,112 is an octal D-type transparent latch with 3-State outputs in a 20-pin TSSOP package. It operates on a 4.5V to 5.5V supply and supports -40°C to +85°C temperatures. Propagation delays range from 1.2ns to 5.3ns depending on the signal path. The device features high output drive capabilities of up to 64mA low-state current.

Feature Summary

• Flow-through pinout configuration facilitates easy interface to microprocessors
• Independent Enable (E) and Output Enable (OE) control gates manage latch and buffer operations
• Power-up 3-State functionality ensures safe initialization without external reset circuits

Applications

• Bus-oriented applications requiring octal data storage
• Driving heavily loaded 3-State buses
• Interfacing with MOS memories or microprocessors

Procurement Notes

Verify the specific ordering suffix matches the required package type and temperature range. Confirm RoHS compliance status for environmental regulations. Check for obsolescence notices as this component may be subject to lifecycle changes. Ensure ESD handling procedures are followed during assembly due to CMOS sensitivity.

Selection Notes

Select this component when a flow-through pinout is preferred over standard configurations for PCB layout optimization. It serves as a functional equivalent to the 74ABT373 but offers improved routing flexibility. Consider the 3-State output buffers for bus sharing requirements and the BiCMOS technology for speed and power balance.

Part Context

This part belongs to the 74ABT logic family, known for high-speed BiCMOS performance. It is functionally identical to the 74ABT373 but utilizes a distinct pinout arrangement. The TSSOP-20 package provides a compact surface-mount solution suitable for dense electronic designs requiring octal latching capabilities.

Replacement Considerations

The 74ABT373 is the primary functional substitute, though it lacks the flow-through pinout. Verify pin compatibility if direct replacement is attempted without redesigning the footprint.