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74AC16373DLRG4 is listed in the Latches range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC D-TYPE TRANSP DUL 8:8 48SSOP. Review the specifications below when checking this part for your BOM.
The SN74AC16373DLRG4 is a 16-bit transparent D-type latch manufactured by Texas Instruments. It features three-state outputs and operates within a supply voltage range of 2.0 V to 4.0 V. The device utilizes a 48-pin SSOP package for surface-mount installation. Key electrical characteristics include a propagation delay of 5.5 ns at 3.3 V and low static power consumption of 20 µA. It supports an output drive current of 32 mA at low level and -24 mA at high level, ensuring robust signal integrity in digital logic applications.
Verify the RoHS compliance status through official manufacturer documentation before integration. Confirm the specific tape-and-reel packaging configuration matches your automated assembly requirements. Ensure the SSOP-48 footprint aligns with your PCB layout guidelines. Check for any recent lifecycle notices regarding production availability or obsolescence warnings from Texas Instruments.
Select this component when a 16-bit parallel latch with three-state capability is required for 3.3 V logic systems. Compare against LVTH or LVC families if lower voltage operation or different speed-power trade-offs are needed. Ensure the 48-SSOP package fits within the mechanical constraints of the target enclosure. Validate that the 5.5 ns propagation delay meets the timing requirements of the system clock.
This part belongs to the standard 74AC logic family, known for faster switching speeds compared to legacy 74LS series while maintaining CMOS low power characteristics. The 'D' suffix indicates the SSOP package type, and 'RG4' denotes the RoHS-compliant green material status. It serves as a foundational building block for wide-data-path digital designs requiring latching functionality.
The SN74AC16373DRG4 is a pin-compatible alternative available in a TSSOP-48 package. Verify that the thermal performance and pin pitch of the replacement package suit the design constraints. Cross-reference datasheets to ensure identical electrical parameters and logical functionality before substitution.
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