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74AC175MTC is listed in the Flip Flops range at ChipApex. The manufacturer field lists Fairchild Semiconductor. Its product description is IC FF D-TYPE SNGL 4BIT 16TSSOP. Review the specifications below when checking this part for your BOM.
The Fairchild Semiconductor 74AC175MTC is a high-speed quad D-type flip-flop housed in a 16-TSSOP package. It operates within a supply voltage range of 2V to 6V, supporting maximum clock frequencies up to 244 MHz. The device features outputs capable of sourcing and sinking 24 mA. It includes a Master Reset input to simultaneously clear all flip-flops when low. Data transfers occur during the LOW-to-HIGH clock transition. This component is obsolete and no longer in production.
This component is officially marked as Obsolete and Not In Production by Fairchild Semiconductor. Verify availability through secondary market channels or authorized distributors handling legacy inventory. Confirm part authenticity and physical condition prior to acquisition, as discontinued items may exhibit age-related degradation. Ensure compatibility with existing system designs before procurement.
Select this component only if legacy design compatibility is required. The AC series offers high speed but lacks TTL-compatible inputs found in ACT variants. Verify that the 16-TSSOP package fits the target PCB layout. Consider modern equivalents if new production is planned, as discontinuation limits long-term supply chain stability. Check voltage levels against current system requirements.
The 74AC175 belongs to the standard 74AC logic family, known for high-speed operation. It is functionally similar to other quad D-flip-flops like the 74AC74 but includes a dedicated Master Reset input. The MTC suffix denotes the 16-TSSOP surface-mount package. Fairchild Semiconductor has since merged into ON Semiconductor, affecting support status.
Public confirmed substitute part numbers include MC74AC175 from ON Semiconductor. Other compatible devices with similar specifications should be evaluated for pinout and electrical parameter alignment. Verify package dimensions and thermal characteristics when transitioning to alternative sources.
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