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74AC540MTC is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists onsemi. Its product description is IC BUFF INVERT 6V 20TSSOP. Review the specifications below when checking this part for your BOM.
The MC74AC540MTC is an octal buffer and line driver from the onsemi AC logic family, housed in a 20-pin TSSOP package. It features eight inverting outputs with three-state capability, allowing for high-impedance isolation when disabled. The device operates within a supply voltage range of 2 V to 6 V, supporting low static power consumption of 8 µA. It provides robust output drive currents of ±24 mA and exhibits propagation delays of 7.5 ns at 3.3 V and 6 ns at 5 V. Designed for surface-mount applications, it functions reliably across an industrial temperature range of -40°C to +85°C.
Verify the specific suffix MTC confirms the TSSOP-20 package and tube packaging format. Confirm RoHS compliance status and moisture sensitivity level requirements for your assembly process. Ensure the ordering part number matches the exact manufacturer designation to avoid pinout or electrical specification mismatches during integration.
Select this component when an octal inverting buffer with three-state control is required for AC logic families. Compare against the non-inverting 74AC541 variant if signal inversion is not desired. Consider the 74HC540 series if lower speed but higher noise immunity is prioritized over the faster AC performance characteristics provided by this device.
This component belongs to the 74AC540 series of octal buffers, designed as a through-bus architecture alternative to standard 240/244 types. It facilitates easier PCB layout for microprocessor interfaces by placing inputs and outputs on opposite sides of the package. The AC series offers a balance between speed and power consumption compared to older HC or HCT logic families.
Direct functional substitutes include the MC74AC540DWG (SOIC-Wide-20) and the MM74AC540MTCX (TSSOP-20 reel). Verify that replacement packages maintain compatible pinouts and thermal characteristics for your specific board design constraints.
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