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74AC540MTCX is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists onsemi. Its product description is IC BUFF INVERT 6V 20TSSOP. Review the specifications below when checking this part for your BOM.
The onsemi 74AC540MTCX is an octal buffer and line driver belonging to the AC logic series. It features eight inverting outputs with three-state capability, housed in a TSSOP-20 surface-mount package. The device operates within a supply voltage range of 2 V to 6 V. Key electrical parameters include a high-level output current of -24 mA and a low-level output current of 24 mA. Propagation delay is specified at 7.5 ns at 3.3 V and 6 ns at 5 V. The component supports industrial operating temperatures from -40°C to +85°C.
Verify the specific suffix 'MTCX' against official datasheets to confirm the TSSOP-20 package and reel packaging configuration. Ensure the order matches the required AC logic family specifications rather than HC or ACT variants. Confirm RoHS compliance status and moisture sensitivity level requirements for your assembly process before finalizing procurement.
Select this component when inverting octal buffering with three-state control is required. The AC series offers faster propagation speeds compared to standard HC logic while maintaining CMOS compatibility. The through architecture layout simplifies PCB routing for parallel data buses. Verify that the 2V to 6V supply range aligns with the system power rails and that the 24 mA drive current meets load requirements.
This part belongs to the MC74AC540/541 series of octal buffers and line drivers manufactured by onsemi. The 540 variant provides inverting outputs, whereas the 541 variant offers non-inverting outputs. Both share similar electrical characteristics and are designed for high-speed digital applications requiring robust bus interfacing capabilities.
MC74AC540DWG: SOIC-Wide-20 package variant with identical electrical performance. 74AC540SCX: Standard SOIC-20 package alternative with matching specifications. Verify package dimensions and thermal characteristics when substituting these cross-reference parts.
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