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74AC540SCX is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists onsemi. Its product description is IC BUFF INVERT 6V 20SOIC. Review the specifications below when checking this part for your BOM.
The onsemi 74AC540SCX is an octal buffer and line driver belonging to the 74AC logic series. It features eight inverting outputs with three-state capability, housed in a 20-SOIC package. The device operates within a supply voltage range of 2 V to 6 V. Key electrical parameters include a high-level output current of -24 mA and a low-level output current of 24 mA. Static current is specified at 4 uA, while operating power supply current reaches 40 uA. Propagation delay is 7.5 ns at 3.3 V and 6 ns at 5 V. The component supports surface mount installation and functions within a temperature range of -40°C to +85°C.
Verify the specific suffix 'SCX' corresponds to the SOIC-20 tape-and-reel packaging configuration. Confirm RoHS compliance status and moisture sensitivity level (MSL 3) requirements against your assembly process specifications. Ensure the inverting logic function aligns with the circuit design intent compared to non-inverting alternatives.
Select this component when an octal inverting buffer with three-state outputs is required for high-speed CMOS applications. The through architecture simplifies PCB layout for microprocessor interfaces. Compare propagation delays and drive strengths against similar AC series devices like the 74AC240 or 74AC541 if non-inverting functionality is needed instead.
This part belongs to the 74AC family of high-speed CMOS logic devices manufactured by onsemi. It serves as a digital buffer designed to isolate stages or drive heavy capacitive loads. The device is functionally related to other octal buffers in the series but is distinguished by its inverting polarity and specific pinout arrangement optimized for system integration.
The MC74AC540DWG is a documented substitute offering identical logical functionality in a wide SOIC package. Verify package dimensions and thermal characteristics when swapping between standard and wide SOIC footprints to ensure mechanical compatibility.
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