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74ACT11244NT is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC BUFF NON-INVERT 5.5V 24DIP. Review the specifications below when checking this part for your BOM.
The Texas Instruments 74ACT11244NT is an octal buffer and line driver featuring three-state outputs, designed for bus-oriented receivers and transmitters. It operates within a supply voltage range of 4.5 V to 5.5 V. The device utilizes an EPIC (Enhanced-Performance Implanted CMOS) process with TTL-voltage compatible inputs. Key electrical characteristics include high-level output current of -24 mA and low-level output current of 24 mA. Propagation delays are specified at 8.9 ns maximum from input A to output Y at 25°C. Static supply current is typically 8 µA.
Verify the obsolete status of this specific part number before procurement planning. Confirm that the plastic DIP package variant remains available or identify active surface-mount equivalents such as the DW or PW series if redesign flexibility exists. Ensure final component selection aligns with current manufacturing lifecycle announcements from Texas Instruments.
Select this component when designing systems requiring eight-channel buffering with three-state control capabilities. The ACT logic family provides speed comparable to LS-TTL while maintaining CMOS power efficiency. Verify that the operating temperature range of -40°C to +85°C meets environmental requirements for the target application environment.
This device belongs to the 74ACT logic family, representing enhanced-performance CMOS technology. It complements the inverting 74ACT11240 to provide flexible combinations of inverting and non-inverting outputs. The NT designation specifically identifies the standard plastic dual-in-line package option within the broader product line.
Active replacements include the 74ACT11244DWR (SOIC package) and 74ACT11244PWR (TSSOP package). Surface-mount variants offer identical electrical performance but require different footprint considerations during board layout adaptation.
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