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74AHC157PW,112 is listed in the Signal Switches, Multiplexers, Decoders range at ChipApex. The manufacturer field lists Nexperia USA Inc.. Its product description is IC MULTIPLEXER 4 X 2:1 16TSSOP. Review the specifications below when checking this part for your BOM.
The Nexperia 74AHC157PW,112 is a quad 2-input multiplexer belonging to the AHC logic family. It selects four bits of data from two sources under the control of a common data select input (S). The enable input (E) is active LOW; when HIGH, all outputs are forced LOW. It operates with CMOS input levels and features balanced propagation delays. The device is specified for supply voltages between 2.0 V and 5.5 V, with an operating temperature range of -40 °C to +125 °C. It utilizes a TSSOP16 package.
Verify the specific ordering suffix against the manufacturer's current catalog to confirm package type and tape/reel specifications. Ensure the component matches the required voltage and temperature ratings for the target application environment. Cross-reference the datasheet revision date to confirm the latest electrical characteristics and pinout definitions are being utilized in the design.
Select this component for applications requiring high-speed CMOS multiplexing with balanced delay characteristics. It is suitable for designs needing direct interface with other CMOS logic families. Consider the TSSOP16 package constraints regarding board space and thermal dissipation. Verify that the input voltage levels align with the driving source requirements within the specified 2.0 V to 5.5 V range.
This part belongs to the 74AHC series of high-speed Si-gate CMOS devices. It is pin-compatible with Low Power Schottky TTL (LSTTL) standards. The device complies with JEDEC standard no. 7A. It offers ESD protection exceeding 2000 V (HBM) and 1000 V (CDM), ensuring robustness against electrostatic discharge events during handling and operation.
Direct replacements include the 74AHC157D (SO16 package) and 74AHC157BQ (DHVQFN16 package) from the same manufacturer. These variants share identical logical functionality but differ in physical package dimensions and mounting style.
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