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74AHC241PW,118 is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC BUF NON-INVERT 5.5V 20TSSOP. Review the specifications below when checking this part for your BOM.
The 74AHC241PW,118 is an octal buffer and line driver featuring three-state outputs. It operates within a supply voltage range of 2.0 V to 5.5 V. The device contains two output enables (1OE and 2OE), allowing configuration as two 4-bit buffers or one 8-bit buffer. Inputs are overvoltage tolerant, accepting voltages up to 5.5 V regardless of the supply voltage. The component is specified for ambient temperatures from -40 °C to +125 °C and utilizes a TSSOP20 package.
Verify the specific ordering suffix against the manufacturer's current documentation to confirm package type and temperature range. Confirm that the intended application environment falls within the specified operating conditions. Ensure input signals do not exceed the absolute maximum ratings defined in the datasheet to prevent permanent damage to the device.
Select this component when an octal buffer with three-state capability is required. The overvoltage-tolerant inputs allow direct interfacing between different logic families without additional level shifting components. Consider the TSSOP20 package constraints regarding thermal dissipation and board space requirements during the design phase.
This part belongs to the 74AHC family of high-speed CMOS logic devices. It serves as an octal buffer/line driver variant within the broader standard logic portfolio. The PW suffix indicates the TSSOP20 plastic thin shrink small outline package. The device provides bidirectional data flow control suitable for system architecture designs requiring bus isolation.
The 74AHCT241PW,118 is a compatible alternative within the same series offering TTL-compatible input levels instead of CMOS levels. Both variants share identical pinouts and functional descriptions but differ in input threshold specifications.
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