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74AHCT126PW-Q100,1 is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Nexperia USA Inc.. Its product description is IC BUF NON-INVERT 5.5V 14TSSOP. Review the specifications below when checking this part for your BOM.
The Nexperia 74AHCT126PW-Q100,1 is a quad buffer and line driver featuring three-state outputs controlled by active HIGH output enable inputs (nOE). A LOW signal on nOE forces the outputs into a high-impedance OFF-state. The device incorporates overvoltage tolerant inputs, enabling its use as a voltage translator in mixed-voltage environments. It operates within a supply voltage range of 4.5 V to 5.5 V and accepts TTL input levels. The component is qualified to AEC-Q100 Grade 1 standards for automotive applications.
Verify the specific ordering code against the manufacturer's current database to ensure compatibility with the TSSOP14 package variant. Confirm that the AEC-Q100 Grade 1 qualification aligns with your project's environmental and reliability requirements. Cross-reference the datasheet revision history to ensure you are using the most recent technical specifications and pinning information.
Select this component when designing interfaces between TTL-level sources and CMOS loads within automotive or industrial environments. The AHCT series specifically ensures compatibility with TTL input thresholds while operating at standard CMOS supply voltages. Ensure the application requires active HIGH output enable control and can accommodate the specified temperature ranges for reliable operation.
This part belongs to the Nexperia 74AHC/AHCT126-Q100 family of quad buffers. It shares functional similarities with other members like the 74AHCT126D-Q100 but differs in physical packaging. The PW suffix indicates the TSSOP14 plastic thin shrink small outline package, providing a compact solution for surface-mount assembly compared to larger SOIC variants.
Direct substitutes include the 74AHCT126D-Q100,11 for SOIC-14 packaging and the 74AHCT126BQ-Q100 for DHVQFN14 packaging. Verify that any replacement maintains the same TSSOP14 footprint if board space is constrained. Ensure the alternative part retains the AEC-Q100 Grade 1 qualification for automotive compliance.
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