74AHCT574BQ,115

Overview

The 74AHCT574BQ,115 is an octal D-type flip-flop with three-state outputs manufactured by Nexperia. It operates within a supply voltage range of 4.5 V to 5.5 V and features a maximum propagation delay of 10.6 ns at 5 V with 50 pF load. The device provides symmetric output currents of 8 mA for both high and low states, with a static current of 4 µA. It utilizes a 20-DHVQFN package (4.5x2.5 mm) and supports a clock frequency up to 75 MHz. Operating temperatures range from -40°C to +125°C.

Feature Summary

• Octal D-type flip-flop architecture with positive-edge triggering
• Three-state non-inverting outputs for bus-oriented applications
• CMOS technology ensuring low power consumption and high noise immunity
• Compliant with JEDEC standards for 5 V tolerant interfaces

Applications

• Parallel-to-serial data conversion circuits
• Buffering and latching operations in digital systems
• Memory address register implementations
• General-purpose shift register configurations

Procurement Notes

Verify the specific suffix '115' corresponds to the DHVQFN-20 package variant when sourcing. Confirm RoHS3 compliance and MSL level 1 status for assembly processes. Cross-reference manufacturer part numbers against distributor codes to ensure exact functional equivalence. Check for recent Product Change Notifications regarding label or assembly site updates prior to final procurement authorization.

Selection Notes

Select this component for designs requiring 5 V logic compatibility with lower voltage control signals. The DHVQFN package offers space efficiency compared to standard SOIC variants. Ensure thermal management accounts for the 125°C maximum junction temperature. Verify that the 8 mA drive capability meets the capacitive load requirements of the target circuit traces.

Part Context

This part belongs to the 74AHCT series, designed for high-speed CMOS operation with TTL-compatible input levels. It serves as a core storage element in digital logic families, providing reliable data retention. The BQ suffix denotes the specific thin-profile QFN packaging suitable for dense surface-mount layouts.

Replacement Considerations

Direct pin-compatible substitutes include the 74AHCT574D,118 in SOIC-20 and the 74AHCT574PW,118 in TSSOP-20. These alternatives share identical electrical characteristics but differ in physical footprint. Verify package dimensions and thermal pad requirements before substituting.