74AUP1G374GM,115

Overview

The Nexperia 74AUP1G374GM,115 is a single D-type flip-flop with positive-edge triggering, housed in an XSON-6 surface-mount package. It operates within a supply voltage range of 0.8 V to 3.6 V and supports data rates up to 250 MHz. Key electrical parameters include a propagation delay of 20.5 ns, output drive currents of ±4 mA, and low static power consumption. The device functions reliably across an extended industrial temperature range from -40 °C to +125 °C.

Feature Summary

• Positive-edge triggered D-type flip-flop operation
• High-speed performance supporting 250 MHz data rates
• Robust ESD protection exceeding 2 kV HBM standards
• Compliance with JEDEC low-voltage logic standards

Applications

• Parallel-to-serial data conversion circuits
• Shift register implementations
• Timing and synchronization logic stages
• General-purpose digital storage elements

Procurement Notes

Verify the specific suffix GM,115 to confirm the XSON-6 package configuration and tape-and-reel quantity. Ensure procurement channels source directly from authorized Nexperia distributors to guarantee component authenticity and adherence to AEC-Q100 automotive qualification requirements where applicable.

Selection Notes

Select this component for applications requiring minimal footprint alongside high-speed edge-triggered storage. The XSON-6 package offers a compact solution compared to traditional TSSOP options. Consider the 20.5 ns propagation delay and ±4 mA drive capability when designing load interfaces and timing constraints.

Part Context

This part belongs to the 74AUP series, representing Nexperia's ultra-low-power CMOS logic family optimized for battery-powered systems. The 74AUP1G374 variant specifically provides a single flip-flop function, distinguishing it from quad-gate logic families. The GM suffix denotes the specific six-lead XSON packaging format.

Replacement Considerations

The 74AUP1G374GW,100H serves as a qualified alternative featuring the same logical function but utilizes a TSSOP6 package instead of XSON-6. Verify pinout compatibility and thermal characteristics before substituting packages.