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74FCT162H245CTPAC is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Cypress Semiconductor Corp. Its product description is IC TRANVR 16BIT N. Review the specifications below when checking this part for your BOM.
The CY74FCT162H245CTPAC is a 16-bit bidirectional bus transceiver manufactured by Cypress Semiconductor. It operates within a voltage range of 4.5V to 5.5V and features two functional units, each handling eight bits. The device utilizes Fast CMOS technology to provide high-speed performance with low power consumption. It includes bus-hold inputs to maintain signal states and three-state outputs for effective bus management. The component is housed in a 48-pin TSSOP package suitable for surface-mount applications.
Verify the specific suffix 'CTPAC' against official Cypress documentation to confirm pinout compatibility and temperature grade. Ensure the source document explicitly lists this part number under the FCT series specifications. Cross-reference the manufacturer's current product status to determine if the component remains active or has been superseded by newer revisions.
Select this component when designing systems that require robust 16-bit bidirectional data paths with minimal propagation delay. The inclusion of bus-hold inputs simplifies PCB layout by eliminating the need for external pull-up or pull-down resistors. Consider the 48-pin TSSOP package dimensions during mechanical design to ensure adequate clearance on the target board.
This device belongs to the FCT (Fast CMOS Technology) family, which bridges the performance gap between standard TTL and advanced CMOS logic. Manufactured originally by Cypress Semiconductor, these components are widely used in legacy and modern digital designs requiring reliable 5V operation. The H245 designation specifically indicates the inclusion of bus-hold functionality compared to standard variants.
Public confirmed substitute part numbers include IDT74FCT162H245ETE and TI74FCT162H245ATPACT. Verify electrical parameters such as output drive current and propagation delay before substitution. Confirm that the alternative package type matches the existing footprint requirements.
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