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74FCT163244APFG8 is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC BUF NON-INVERT 3.6V 48TVSOP. Review the specifications below when checking this part for your BOM.
The 74FCT163244APFG8 is a 3.3V octal buffer and line driver manufactured by Renesas Electronics. It operates within a supply voltage range of 2.7 V to 3.6 V. The device features eight non-inverting inputs and outputs with three-state capability. Electrical characteristics include a high-level output current of -8 mA and a low-level output current of 24 mA. Static current consumption is specified at 100 nA, while operating supply current is 2 mA. The component supports surface-mount installation in an SSOP-48 package and functions reliably across a temperature range of -40°C to +85°C.
Verify the specific suffix '8' against official Renesas documentation to confirm tape-and-reel packaging specifications. Ensure the SSOP-48 package dimensions match the target PCB footprint. Confirm RoHS compliance status through the manufacturer's latest certification records before finalizing procurement orders.
Select this component when designing 3.3V logic interfaces requiring octal buffering. Compare performance against similar FCT series devices based on required drive strength and propagation delay. Ensure the input voltage levels are compatible with the driving source signals to prevent undefined states or excessive current draw during operation.
This part belongs to the 74FCT163244 family of high-speed CMOS buffers. It serves as a successor to earlier logic families, offering improved speed and lower power consumption. The device is designed for applications demanding reliable signal transmission in dense digital circuits, supporting modern system requirements for efficiency and performance.
Check for direct pin-compatible alternatives such as the IDT74FCT163244APVG. Verify that substitute components maintain identical electrical characteristics and package dimensions to ensure seamless integration without redesigning the host circuit board.
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