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74FCT163244APVG is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists IDT, Integrated Device Technology Inc. Its product description is IC BUFFER NON-INVERT 3.6V 48SSOP. Review the specifications below when checking this part for your BOM.
The IDT74FCT163244APVG is a 3.3V 16-bit buffer and line driver belonging to the FCT logic series. It features four input lines and four output lines with non-inverting polarity, housed in a 48-pin SSOP package for surface mount installation. The device operates within a supply voltage range of 2.7V to 3.6V and supports an operating temperature range from -40°C to +85°C. Electrical characteristics include a high-level output current of -8mA and a low-level output current of 24mA, with a static current of 100nA.
Verify the specific suffix 'APVG' against the manufacturer's latest datasheet to confirm pinout compatibility and package dimensions. Confirm RoHS compliance status and moisture sensitivity level requirements before integration into the assembly process. Ensure the selected variant matches the required voltage domain and drive strength specifications for the target application circuit.
Select this component when a 16-bit non-inverting buffer with strong drive capability is required for 3.3V logic systems. Consider the -8mA/24mA output currents for driving moderate capacitive loads. Verify that the SSOP-48 package fits the PCB footprint constraints and that the thermal performance meets the operational environment requirements.
This part belongs to the 74FCT family, which serves as a high-speed, low-power CMOS replacement for older ABT functions. The FCT series is designed to bridge the gap between standard TTL and advanced CMOS technologies, offering improved speed and lower power consumption while maintaining compatible logic levels.
Check for direct cross-reference equivalents such as the IDT74FCT163244 or Renesas Electronics variants within the same FCT family. Ensure any substitute maintains identical pin configuration, electrical parameters, and package type to guarantee drop-in compatibility without redesigning the host board.
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