74FCT38072SDCGI8

Overview

The 74FCT38072SDCGI8 is a low skew, single input to two output LVCMOS clock buffer manufactured by Renesas Electronics. It features an additive phase jitter of sub-50fs RMS and extremely low output skew of 50ps. The device operates with supply voltages ranging from 1.8V to 3.3V and supports input/output clock frequencies up to 200MHz. Packaged in an 8-pin SOIC (0.154" width), it utilizes low-power CMOS technology and functions within an extended temperature range of -40°C to +105°C.

Feature Summary

• Low additive phase jitter: 50fs RMS
• Extremely low skew outputs: 50ps
• Input/Output clock frequency up to 200MHz
• Operating voltage range: 1.8V to 3.3V

Applications

• Clock distribution networks requiring minimal jitter
• High-speed digital systems with strict timing constraints
• Low-voltage logic interfaces (LVCMOS/LVTTL)

Procurement Notes

Verify the package type is 8-SOIC (3.90mm wide) and confirm the suffix 'DCGI8' corresponds to the reel packaging configuration. Ensure the operating temperature range meets the specific application requirements of -40°C to +105°C. Cross-reference the manufacturer part number with official Renesas documentation to validate current production status and availability.

Selection Notes

Select this component for applications demanding sub-50fs jitter performance and 1:2 fan-out capabilities. Compare against other 74FCT38072 variants based on required packaging (SOIC vs DFN) and specific voltage levels within the 1.8V to 3.3V range. Consider the 200MHz maximum frequency limit when designing high-speed clock paths.

Part Context

This part belongs to the 74FCT38072 series of low skew clock buffers. It serves as a specialized variant within the broader 74FCT family, designed specifically for noise-sensitive clock distribution tasks where signal integrity is critical. The SD suffix typically denotes the SOIC package option.

Replacement Considerations

Direct replacements include other 74FCT38072 variants such as 74FCT38072SCMGI or 74FCT38072DCGI, provided the package footprint and electrical specifications match the design constraints.