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The National Semiconductor 74FCT574APC is an octal D-type flip-flop featuring tri-state outputs, housed in a 20-pin DIP package. It operates within a supply voltage range of 4.75V to 5.25V and supports through-hole mounting. The device exhibits a quiescent current of 40 µA and an input capacitance of 6 pF. Designed for industrial temperature ranges, it functions reliably between 0°C and 70°C. This component provides synchronous data storage with non-inverted outputs, suitable for high-speed digital logic applications requiring low skew performance.
Verify the manufacturer designation carefully, as this component was originally produced by National Semiconductor, which is now part of Texas Instruments. Ensure the specific suffix 'APC' corresponds to the 20-pin DIP through-hole package variant. Confirm that the operating temperature range meets your environmental requirements, as commercial grades may differ from industrial specifications. Cross-reference datasheets to ensure pinout compatibility if substituting with newer revisions or equivalent parts from other manufacturers.
Select this component when a through-hole octal register with tri-state outputs is required for legacy or robust PCB designs. The 20-pin DIP format facilitates prototyping and manual assembly. Consider the 40 µA quiescent current for power-sensitive systems. Verify that the 0°C to 70°C operating range aligns with your application's thermal environment. Compare propagation delay characteristics against system clock speeds to ensure timing margins are sufficient for your specific synchronous design constraints.
This device belongs to the 74FCT logic family, known for Fast CMOS technology offering speed comparable to LS-TTL with lower power consumption. The 74FCT574 series specifically provides octal storage elements. National Semiconductor developed this line before its acquisition by Texas Instruments, which continues to support and manufacture related FCT components under the TI brand portfolio.
Equivalent parts include the CY74FCT574ATQCT (Texas Instruments) for surface mount applications, though package differences exist. Direct pin-compatible replacements should be verified against updated datasheets to ensure identical electrical characteristics and package dimensions.