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The Renesas Electronics Corporation 74FCT574TQG is an octal D-type flip-flop featuring three-state outputs, designed for high-speed digital logic applications. It operates within a supply voltage range of 4.5V to 5.5V and supports a maximum clock frequency of 10 MHz. The device exhibits a typical propagation delay of 6.2 ns and provides robust output drive capabilities with low-level output current of 48 mA and high-level output current of -15 mA. Housed in a 20-pin SOIC package, it functions reliably across an industrial temperature range from -40°C to +85°C.
Verify the specific suffix 'QG' against official Renesas documentation to confirm package type and tape/reel specifications. Ensure compatibility with existing PCB footprints for the 20-pin SOIC configuration. Cross-reference the manufacturer part number with authorized distributors to confirm current production status and availability. Check for any recent product change notices affecting pinout or electrical parameters before finalizing procurement orders.
Select this component when designing systems that require octal data latching with high-speed operation at 5V logic levels. Consider its 6.2 ns propagation delay for timing-critical paths where moderate speed suffices. Evaluate the 48 mA sink capability for driving multiple loads on shared buses. Compare against other FCT series variants if lower voltage operation or different package formats are required for space-constrained designs.
The 74FCT574TQG belongs to the Fast CMOS (FCT) logic family, which bridges the performance gap between standard TTL and CMOS technologies. This series is characterized by high switching speeds while maintaining low power dissipation. As an octal flip-flop, it serves as a fundamental building block for sequential logic circuits, enabling efficient data management in complex digital architectures developed by Renesas Electronics.
Direct substitutes include the IDT74FCT574TQG and Texas Instruments CY74FCT574TQG, which share identical logical functionality and pin configurations. Verify that alternative sources offer the same 20-pin SOIC package and electrical specifications to ensure seamless integration without redesigning the host circuit board.