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74FCT621TSOG is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC TXRX NON-INVERT 5.25V 20SOIC. Review the specifications below when checking this part for your BOM.
The 74FCT621TSOG is an octal bus transceiver manufactured by Renesas Electronics Corporation. It features non-inverting open-drain outputs compatible with bus systems in both send and receive directions. The device operates within a supply voltage range of 4.5 V to 5.5 V and utilizes a 20-pin SOIC package. It belongs to the FCT logic series, designed for high-speed data transfer applications requiring robust signal integrity and bidirectional communication capabilities.
Verify the specific suffix TSOG against the official Renesas datasheet to confirm package type and temperature grade. Ensure the ordering part number matches the required RoHS compliance status. Cross-reference manufacturer documentation for any recent product change notices affecting pinout or electrical characteristics before finalizing procurement.
Select this component when designing systems requiring octal wide-bus interfaces with open-drain termination. It is suitable for applications needing non-inverting signal direction control. Consider the 20-SOIC footprint constraints and operating voltage limits during schematic capture. Validate that the open-drain nature aligns with the pull-up requirements of the target bus topology.
This component is part of the 74FCT family of high-speed CMOS logic devices. It serves as a standard solution for interfacing between microprocessors and peripheral devices. The T suffix typically denotes tape and reel packaging, while SOIG indicates the surface-mount package style used in automated assembly processes.
The IDT74FCT621ATSOG is documented as an alias for this component. Verify functional equivalence and pin compatibility before substitution. Consult official cross-reference guides to ensure identical electrical specifications and package dimensions.
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