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The NXP USA Inc. 74HC02N,652 is a quad 2-input NOR gate manufactured by Nexperia under the HC logic series. It operates within a supply voltage range of 2.0 V to 6.0 V and features CMOS low power dissipation with high noise immunity. The device includes input clamp diodes for interfacing with voltages exceeding VCC. It complies with JEDEC standards JESD8C and JESD7A, offering ESD protection exceeding 2000 V (HBM) and 1000 V (CDM). Latch-up performance exceeds 100 mA per JESD 78 Class II Level B. Operating temperatures are specified from -40 °C to +125 °C.
Verify the specific package type against the ordering information table in the datasheet, as multiple packages such as SO14, TSSOP14, DHVQFN14, and DHXQFN14 are available for the 74HC02 family. Confirm that the 'N' suffix corresponds to the required physical footprint and lead configuration for your PCB design. Ensure environmental compliance requirements match the RoHS status indicated in the product documentation.
Select this component when a quad NOR gate is required within standard CMOS logic families. The HC series offers compatibility with standard CMOS levels, distinguishing it from the HCT variant which supports TTL levels. Consider the wide operating temperature range and robust ESD protection if the application environment demands high reliability. Verify that the supply voltage constraints align with the system's power rails before integration.
This component belongs to the 74HC/HCT logic family, widely used for general-purpose digital applications. The 74HC02 specifically implements the NOR function, providing four independent gates in a single package. It is part of a broader ecosystem of compatible logic devices designed to interface seamlessly within mixed-signal or purely digital systems requiring standard logic levels.
Compatible substitutes include other manufacturers' 74HC02 variants that adhere to the same pinout and electrical specifications. Ensure any replacement maintains the 2.0 V to 6.0 V operating range and similar propagation delay characteristics. Cross-reference package dimensions if substituting between different package types like SOIC and TSSOP.