74HC08PW,118

Overview

The Nexperia 74HC08PW,118 is a quad 2-input AND gate in the HC logic family. It operates within a supply voltage range of 2.0 V to 6.0 V and supports an ambient temperature range from -40 °C to +125 °C. The device utilizes a TSSOP14 (SOT402-1) package with 14 leads. Static characteristics include low power dissipation and high noise immunity. Dynamic performance at 4.5 V features a typical propagation delay of 9 ns and transition time of 7 ns.

Feature Summary

• CMOS technology providing low power dissipation
• High noise immunity for reliable signal processing
• Latch-up performance exceeding 100 mA per JESD 78 Class II Level B
• Input clamp diodes enabling interface to voltages exceeding VCC

Applications

• Digital logic circuits requiring quad AND functionality
• Mixed 5 V and 3.3 V system interfacing
• Industrial control applications operating across extended temperatures

Procurement Notes

Verify the specific ordering suffix matches the required package variant. Confirm that the component meets the necessary environmental standards for the intended deployment. Ensure compatibility with existing PCB footprint dimensions for the TSSOP14 housing before finalizing procurement decisions.

Selection Notes

Select this component when a quad 2-input AND gate is required within the HC series. It is suitable for designs needing operation up to 6.0 V. Consider the TSSOP14 package constraints regarding thermal derating above 81 °C. Verify input voltage levels align with CMOS specifications rather than TTL requirements.

Part Context

This part belongs to the Nexperia 74HC08 product line, which includes variants such as the SO14 package version. The PW suffix specifically denotes the thin shrink small outline plastic package. It shares functional similarities with other single-function gates but is distinct from XOR or NAND logic families.

Replacement Considerations

The 74HC08D,118 serves as a direct alternative using the SO14 package. Other compatible options within the same logic family may be considered if package form factor changes are acceptable.