74HC107PW,118

Overview

The Nexperia 74HC107PW,118 is a dual J-K negative edge-triggered flip-flop in the HC logic series. It features differential outputs and single-ended inputs within a TSSOP-14 surface-mount package. The device operates on a supply voltage range of 2 V to 6 V. At 5 V, it exhibits a propagation delay of 16 ns with output currents of ±5.2 mA. It supports an operating temperature range from -40 °C to +125 °C.

Feature Summary

• Dual J-K negative edge-triggered flip-flops providing state storage capabilities
• Differential output configuration for signal integrity
• Wide supply voltage operation supporting low-power applications

Applications

• Digital data storage circuits
• Frequency division networks
• Shift register construction

Procurement Notes

Verify the complete part number including the suffix ',118' to ensure correct reel packaging specifications. Confirm that the TSSOP-14 footprint matches the target PCB layout dimensions. Check RoHS compliance status against current regulatory requirements for the intended market. Ensure static protection measures are applied during handling due to CMOS sensitivity.

Selection Notes

Select this component when dual independent flip-flops are required in a compact surface-mount form factor. The HC series offers standard speed suitable for general-purpose digital logic. Verify that the 2 V to 6 V supply range aligns with the system power rails. Consider the TSSOP-14 thermal characteristics if high ambient temperatures are expected.

Part Context

This device belongs to the 74HC family of high-speed CMOS logic products manufactured by Nexperia. It provides industry-standard pin compatibility with other 74HC series components. The product line emphasizes reliability and low power consumption for consumer and industrial electronics.

Replacement Considerations

Cross-reference with other manufacturers offering 74HC107 devices in TSSOP-14 packages. Verify electrical parameter equivalence, specifically propagation delay and output drive current. Ensure mechanical footprint compatibility before substitution.