74HC175DB,118

Overview

The 74HC175DB,118 is a quad D-type flip-flop manufactured by Nexperia USA Inc. It operates within a supply voltage range of 2 V to 6 V and features complementary outputs. The device includes a master reset function and utilizes CMOS technology for low power dissipation. Packaged in a 16-TSSOP format, it supports surface mount installation. The component is designed for high noise immunity and complies with JEDEC standards.

Feature Summary

• Quad D-type flip-flop architecture with complementary outputs
• Master reset functionality for synchronous clearing
• Wide operating voltage range from 2.0 V to 6.0 V
• High noise immunity and ESD protection capabilities

Applications

• Digital data storage circuits
• Shift register configurations
• Parallel-to-serial conversion systems
• Timing and control logic applications

Procurement Notes

Verify current availability status as the product may be subject to discontinuation or limited supply. Confirm package type matches design requirements. Check RoHS compliance documentation. Validate lead times with authorized distributors. Ensure compatibility with existing PCB footprint specifications.

Selection Notes

Select this component for designs requiring quad D-type flip-flops with master reset. Consider the 16-TSSOP package for space-constrained layouts. Verify voltage levels match system requirements between 2 V and 6 V. Evaluate thermal performance for intended operating temperature ranges. Compare against alternative logic families if specific timing characteristics are critical.

Part Context

This part belongs to the 74HC series of high-speed CMOS logic devices. It provides standard digital logic functions suitable for general-purpose applications. The manufacturer offers extensive support documentation including datasheets and ECAD models. The product line emphasizes reliability and compliance with industry standards.

Replacement Considerations

The M74HC175TTR from STMicroelectronics is listed as an available substitute. Verify pinout compatibility and electrical parameters before substitution. Ensure package dimensions match the existing design constraints.