74HC175PW,118

Overview

The 74HC175PW,118 is a quad D-type flip-flop manufactured by Nexperia USA Inc. It operates within a supply voltage range of 2 V to 6 V and features a 16-TSSOP package. The device exhibits a maximum propagation delay of 26 ns at 6 V with 50 pF load and maintains a static current of 4 µA. It supports a clock frequency of 61 MHz and functions across an operating temperature range of -55°C to +125°C.

Feature Summary

• Provides four independent D-type flip-flops with positive edge triggering for sequential logic applications.
• Includes a master reset function to initialize all outputs simultaneously.
• Features complementary output types suitable for various digital interface requirements.

Applications

• Data storage and register circuits in digital systems
• Shift register configurations for serial-to-parallel conversion
• Sequential control logic in industrial automation

Procurement Notes

Verify the specific suffix '118' corresponds to the TSSOP-16 packaging and reel specifications required for your assembly process. Confirm RoHS compliance status through official Nexperia documentation prior to integration. Ensure the component meets the thermal and electrical ratings defined in the datasheet for your target environment.

Selection Notes

Select this component when a compact quad D-flip-flop solution is needed with low static power consumption. The wide supply voltage range allows compatibility with both 3.3 V and 5 V logic families. The high clock frequency capability supports high-speed data processing tasks requiring reliable state retention.

Part Context

This part belongs to the 74HC series of high-cmOS logic integrated circuits. It serves as a successor or alternative to older TTL-based flip-flops, offering improved noise immunity and lower power dissipation. The 16-TSSOP package provides a space-efficient surface-mount option for modern PCB designs.

Replacement Considerations

The STMicroelectronics M74HC175TTR is identified as a compatible alternative. Verify pinout compatibility and electrical parameter alignment before substitution. Check for any differences in package dimensions or moisture sensitivity levels that may affect manufacturing processes.