74HC240D,652

Overview

The Nexperia 74HC240D,652 is an octal buffer and line driver with inverting logic functionality. It operates within a supply voltage range of 2 V to 6 V and utilizes a surface-mount SOIC-20 package. The device features three-state outputs capable of driving up to 7.8 mA at both high and low states. Propagation delay is specified at 150 ns under a 15 pF load condition at the minimum operating voltage.

Feature Summary

• Provides eight independent inverting buffer channels for signal conditioning
• Features three-state outputs to facilitate bus-oriented architectures
• Compatible with standard CMOS logic input levels

Applications

• Bus-oriented systems requiring signal buffering
• Memory address drivers
• Clock distribution circuits

Procurement Notes

Verify current manufacturing status as this component may be subject to obsolescence or limited availability. Confirm RoHS compliance and halogen-free status through official datasheets before integration. Ensure the SOIC-20 package dimensions match PCB footprint requirements. Validate electrical parameters against specific application conditions.

Selection Notes

Select this component when designing systems requiring eight-channel inversion with three-state control. The HC series offers compatibility with standard CMOS inputs while providing sufficient drive current for moderate loads. Consider the SOIC-20 package for surface-mount assembly constraints. Verify that the 2 V to 6 V operating range aligns with the system power supply.

Part Context

This part belongs to the Nexperia 74HC family of high-speed CMOS logic devices. The 74HC240 specifically denotes an octal buffer configuration. The suffix 652 indicates the specific tape and reel packaging format used for automated assembly processes. This series is designed for applications demanding low power consumption and wide voltage operation.

Replacement Considerations

Cross-reference with other manufacturers' 74HC240 equivalents such as SN74HC240 or MC74HC240. Ensure pinout compatibility and electrical specifications match the original design requirements. Verify that alternative packages maintain the same thermal and mechanical characteristics.