74HC2G16GVH

Overview

The Nexperia 74HC2G16GVH is a high-speed Si-gate CMOS dual buffer gate housed in a SC-74 (TSOP6) package. It provides two independent buffers with balanced propagation delays and unlimited input rise/fall times. The device operates within a supply voltage range of 2.0 V to 6.0 V, complying with JEDEC standards JESD8C and JESD7A. It supports an ambient temperature range from -40 °C to +125 °C and includes ESD protection exceeding 2000 V (HBM) and 1000 V (CDM).

Feature Summary

• High-speed Si-gate CMOS technology ensuring balanced propagation delays.
• Wide supply voltage operation from 2.0 V to 6.0 V.
• Unlimited input rise and fall times for flexible signal handling.
• Robust ESD protection compliant with ANSI/ESDA/JEDEC standards.

Applications

• Signal buffering in mixed-voltage digital systems.
• Level translation between different logic families.
• General-purpose buffering in consumer electronics.

Procurement Notes

Verify the specific ordering suffix 'H' against official Nexperia documentation to confirm tape-and-reel packaging specifications. Ensure the SC-74 package variant matches design footprint requirements. Confirm availability status directly with authorized distributors as stock levels fluctuate. Validate that the component meets all environmental and electrical specifications required for the target application before finalizing procurement.

Selection Notes

Select the 74HC2G16GVH when dual buffering is required within a compact SC-74 footprint. This part is suitable for applications needing wide supply voltage compatibility from 2.0 V to 6.0 V. Consider this device for designs requiring high noise immunity and low power dissipation. Verify that the operating temperature range of -40 °C to +125 °C aligns with system thermal constraints.

Part Context

This component belongs to the Nexperia 74HC series of high-speed CMOS logic devices. It is functionally related to other single-dual logic gates in the same family, such as NAND or NOR variants, but specifically configured as a buffer. The SC-74 package offers a small surface-mount solution compared to larger DIP packages, facilitating dense PCB layouts.

Replacement Considerations

The 74HC2G16GW serves as a direct functional replacement using the TSSOP6 package. Ensure pinout compatibility and verify that the alternative package dimensions fit the existing PCB footprint without modification.