74HC367DB,112

Overview

The 74HC367DB,112 is a hex buffer and line driver manufactured by Nexperia. It features six non-inverting buffers with three-state outputs controlled by active-low output enable inputs (nOE). The device operates within a supply voltage range of 2.0 V to 6.0 V for the HC variant and 4.5 V to 5.5 V for the HCT variant. It utilizes an SSOP-16 package (SOT338-1) containing 16 leads. The component provides high noise immunity and low power dissipation characteristics.

Feature Summary

• Hex buffer configuration with three-state outputs
• Active-low output enable control
• CMOS low power dissipation design
• High noise immunity performance

Applications

• Bus driver applications
• Line driving circuits
• Buffering digital signals

Procurement Notes

Verify the specific ordering suffix against current manufacturer documentation to confirm package type and temperature range specifications. Confirm availability status as product lifecycles may change. Ensure compatibility with system voltage requirements before integration. Check for any recent revisions to the datasheet that might affect pinout or electrical characteristics.

Selection Notes

Select this component when a hex buffer with three-state capability is required for bus interfacing. Consider the HC series for wider voltage operation or the HCT series for TTL-compatible input levels. Verify thermal management requirements based on total power dissipation limits and ambient operating conditions specified in the datasheet.

Part Context

This part belongs to the 74HC/HCT logic family, which includes hex buffers and line drivers. Similar variants include the 74HC367D and 74HCT367D in SO16 packages. The DB suffix indicates the SSOP-16 plastic small outline package variant. These components are designed for general-purpose digital logic buffering and signal transmission tasks.

Replacement Considerations

Direct functional substitutes include other 74HC367 or 74HCT367 parts from compatible manufacturers. Verify package dimensions and pin configurations match the existing PCB layout. Ensure electrical parameters such as propagation delay and output drive strength meet application requirements.