74HC367DB,118

Overview

The 74HC367DB,118 is a hex buffer and line driver manufactured by Nexperia. It features six non-inverting buffers with three-state outputs controlled by active-low output enable inputs (nOE). The device operates within a supply voltage range of 2.0 V to 6.0 V and supports an ambient temperature range from -40 °C to +125 °C. It utilizes CMOS technology for low power dissipation and includes input clamp diodes to allow interfacing with voltages exceeding VCC using current-limiting resistors.

Feature Summary

• Hex buffer configuration with three-state outputs controlled by active-low nOE inputs
• CMOS technology providing wide supply voltage operation and low power dissipation
• Input clamp diodes enabling interface to voltages in excess of VCC
• High noise immunity and robust latch-up performance

Applications

• Bus-oriented communications systems
• Clock distribution networks
• Memory module data buffering

Procurement Notes

Verify the specific package variant against the ordering information table. The datasheet revision history indicates that type numbers ending in 'DB' (SSOP16) were removed in version 4; confirm the availability of the SO16 or TSSOP16 equivalent if the DB suffix is not currently supported in production channels.

Selection Notes

Select this component for applications requiring high-speed signal buffering with tri-state control. Ensure the logic family matches the system voltage levels, as HC series requires CMOS level inputs. Verify thermal derating requirements based on the selected package type and maximum ambient operating temperature.

Part Context

This part belongs to the 74HC/HCT logic family, designed for general-purpose digital applications. It serves as a standard hex buffer solution for managing signal integrity and driving loads across multiple buses. The device is compliant with JEDEC standards for various supply voltage ranges.

Replacement Considerations

Check for 74HCT367 variants if TTL-level input compatibility is required instead of CMOS levels. Verify package footprint compatibility between SO16 and TSSOP16 if physical replacement is necessary.