74HC377DB,112

Overview

The Nexperia 74HC377DB,112 is an octal D-type flip-flop with positive-edge triggering, housed in a 20-SSOP package. It operates within a supply voltage range of 2.0 V to 6.0 V and supports data rates up to 50 MHz at 5 V. The device features non-inverting outputs and includes clamp diodes on inputs for system protection. It complies with JEDEC standards and offers high noise immunity with low power dissipation.

Feature Summary

• Octal D-type flip-flop architecture with positive-edge clock triggering
• Non-inverting outputs suitable for bus-oriented applications
• Input clamp diodes allow interfacing with voltages exceeding VCC

Applications

• Parallel-to-serial data conversion circuits
• Bus interface modules requiring edge-triggered storage
• General-purpose digital logic systems operating between 2V and 6V

Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS compliance status and check for recent Product Change Notifications (PCNs) regarding marking or assembly updates. Ensure the specific SSOP package variant matches design requirements before finalizing procurement orders.

Selection Notes

Select this component when an octal edge-triggered storage element is required within standard HC logic voltage ranges. It serves as a functional alternative to transparent latches like the 74HC373 where precise clock synchronization is necessary. Verify that the 20-SSOP footprint aligns with existing PCB layout constraints.

Part Context

This part belongs to the Nexperia 74HC series, representing high-speed CMOS logic technology. It provides compatibility with standard TTL input levels while maintaining low power consumption. The device is designed for general-purpose digital applications requiring reliable data storage and transfer across multiple lines simultaneously.

Replacement Considerations

The 74HC377PW,118 offers identical logical functionality in a TSSOP-20 package. Designers must verify pinout compatibility and thermal characteristics when substituting the SSOP package for the TSSOP variant or vice versa.