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Product Detailed Parameters
- Description:IC BUFFER NON-INVERT 6V 8TSSOP
- Series:74HC
- Mfr:Nexperia USA Inc.
- Package:Tape & Reel (TR),Cut Tape (CT)
- Logic Type:Buffer, Non-Inverting
- Number of Elements:3
- Number of Bits per Element:1
- Input Type:-
- Output Type:Open Drain
- Current - Output High, Low:-, 5.2mA
- Voltage - Supply:2V ~ 6V
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Supplier Device Package:8-TSSOP
- Grade:-
- Qualification:-
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Overview
The Nexperia 74HC3G07DP,125 is a triple buffer with open-drain outputs housed in an SOT505-2 (TSSOP8) package. It operates within a supply voltage range of 2.0 V to 6.0 V and supports ambient temperatures from -40 °C to +125 °C. The device features CMOS low power dissipation, high noise immunity, and inputs equipped with clamp diodes for interfacing voltages exceeding VCC. Static characteristics specify a maximum LOW-level output voltage of 0.4 V at 5.2 mA drive current. Dynamic performance includes propagation delays ranging from 16 ns to 25 ns depending on the supply voltage.
Feature Summary
- Triple buffer configuration with open-drain outputs
- Inputs include clamp diodes for over-voltage interfacing
- High noise immunity and CMOS low power dissipation
Applications
- General-purpose buffering in digital logic circuits
- Open-drain driving applications requiring external pull-up resistors
- Mixed-signal environments utilizing input clamp diodes
Procurement Notes
Verify the specific ordering suffix matches the required package variant. Confirm that the application design accounts for the open-drain nature of the outputs, which necessitates external pull-up components for proper HIGH-state operation. Ensure supply voltage constraints align with the specified 2.0 V to 6.0 V operating range.
Selection Notes
Select this component when a triple buffer with open-drain capability is required. The HC series offers compatibility with standard CMOS logic levels across a wide voltage range. Consider the TSSOP8 package dimensions if board space is constrained. Verify that the open-drain architecture meets the interface requirements compared to push-pull alternatives.
Part Context
This part belongs to the Nexperia 74HC/HCT3Gxx family of triple gate ICs. These devices are designed for compact surface-mount applications. The DP suffix indicates the TSSOP8 plastic thin shrink small outline package. This family provides multiple logic functions within minimal footprint solutions suitable for portable electronics.
Replacement Considerations
The 74HCT3G07DP,125 serves as a TTL-compatible alternative within the same package. Other variants such as the 74HC3G07DC utilize a different VSSOP8 package.
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